Staff Directory

Kaoru Uema Porter

Kaoru Uema Porter

Research Associate

Research Associate

College of Engineering

(ELEG)-Electrical Engineering

Phone: 479-575-8606

Fax: (479) 575-2719

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Kaoru U. Porter received the B.S. and M.S. degrees in electrical engineering from the University of Arkansas at Fayetteville, in 1995 and 1997, respectively. Currently holding the title of Research Associate, Ms. Porter manages the operation of the High Density Electronics Center (HiDEC) Ceramic Integration Laboratory housed within the University of Arkansas’ Department of Electrical Engineering. Ms. Porter has been in her current position since 2007 providing equipment and process training associated with low temperature co-fired ceramic (LTCC).

Silke Spiesshoefer, Leonard Schaper, Kaoru Maner, Errol Porter, Fred Barlow, George Bates, Mike Lucas, Bill Marsh, University of Arkansas; Michael Glover, “Z-axis Interconnection for 3-D High-Density Packaging”, Northrop Grumman, 2001 Proceedings of the International Symposium on Microelectronics, Baltimore, Maryland, October, 2001.

Kaoru Maner, Errol Porter, Len Schaper, Simon S. Ang, and William D. Brown, "The Seamless High Off-Chip Connectivity (SHOCC) packaging technology", Proc. of the Electrochemical Society, (1999) pp. 188-191.

Kaoru Maner, Simon S. Ang, Len Schaper, and William D. Brown, "Polymeric conductive pastes as solder replacement for flip-chip attachment.", IEEE Transactions on Components, Packaging, and Manufacturing Tech., Part A and B, (1998) pp. 247-251. 

Len Schaper, Kaoru Maner, and Simon S. Ang, "Reliability of large conductive polymer flip chip assemblies for multichip modules (MCMs)", Proc. of the Int. Conf. on Multichip Modules, (1997) pp. 87-91.

Kaoru Maner, Simon S. Ang, and Len Schaper, "Reliability of large conductive polymer flip chip assemblies for multichip modules (MCMs)", Proc. of the Int. Elect. Packaging Conf. (IEPC) (1996) pp. 3-13.

2007 – Present  Research Associate  -- Low Temp Co-Fired Ceramics Lab, U of A, Fayetteville, AR

2006 – 2007      Research Support – Arisetek, LLC., Fayetteville, AR

2006 – 2006      Senior Process Development Engineer – OmniPak LLC., Fayetteville, AR

2003 – 2005      Unit Pay Employee -- High Density Electronics Center, U of A, Fayetteville, AR

2004 – 2004      Senior Process Development Engineer – Moducell, Inc., Fayetteville, AR

2002 – 2003      Process Development Engineer – Integral Wave Technology, Fayetteville, AR

1997 – 2002      Research Assistant -- University of Arkansas, Fayetteville, AR